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HVC vs EBG: HV Thick Film Resistor Performance Benchmark

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HVC vs EBG: HV Thick Film Resistor Performance Benchmark

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Technical Abstract

Abstract: This white paper presents a comprehensive performance benchmark of HVC HVR series against EBG/Miba series across four dimensions: electrical parameters, materials and processes, temperature characteristics, and long-term reliability. All data is compiled from published datasheets and completed sample test results. A full replacement cross-reference table aligned with PDF body suffixes and customer-validated case studies are included at the end. Specific part numbers are subject to mutually confirmed technical agreements.

1. Electrical Parameter Comparison: Planar to Planar, Cylindrical to Cylindrical

1.1 Planar Series Parameter Mapping (FBX/FEP/FSX vs HVRGFP)

Planar thick film resistors are the most commonly used voltage divider and sampling components on high-voltage power supply PCBs. EBG's FBX/FEP/FSX series covers sizes from 6/5 mm to 30 mm, with a maximum operating voltage of 29 kV DC. Below is a detailed comparison of the core electrical parameters between the two brands:

ParameterEBG FBX/FEP/FSX SpecHVC HVRGFP SpecComparison
Voltage Range (DC)Up to 29 kVUp to 35 kV (05~50 multiple range options)HVC exceeds EBG at high end
Resistance Range200 Ohm ~ 2 GOhm100 Ohm ~ 10 GOhmHVC covers wider range
TCR (ppm/C)+/-80 (<=100 MOhm range)+/-25 ~ +/-100 multiple optionsHVC offers TCR flexibility
Precision Tolerance+/-0.5% ~ +/-10%+/-0.5%(F) ~ +/-5%(J)EBG offers 0.1% ultra-precision; HVC offers custom
Operating Temp Range-55 C ~ +155 C-55 C ~ +155 CIdentical
Substrate Material96% Al2O3 Ceramic96% Al2O3 CeramicSame
Rated Power1~5 W (depends on size)1~5 W (depends on size)Comparable

1.2 Cylindrical Series Parameter Mapping (SGT vs HVR-BSP, Representative Models)

The SGT is the flagship product in EBG's cylindrical line, renowned for its ultra-low TCR of +/-25 ppm and operating voltage up to 48 kV, widely used in CT scanners and high-end X-ray equipment for precision voltage divider sampling. The HVC BSP series is the direct counterpart:

ParameterEBG SGT SpecHVC HVR-BSP SpecComparison
Voltage Range (DC)Up to 48 kVUp to 60 kV+ (higher with longer tube)HVC covers and exceeds
Resistance Range100 kOhm ~ 1 GOhm10 kOhm ~ 10 GOhmHVC wider
TCR+/-25 ppm/C+/-25 ppm/C (BSP low TCR grade -F-25-)Exactly aligned
Precision Tolerance+/-0.1% ~ +/-10%+/-0.5%(F) ~ +/-5%(J)0.1% via custom sample approval
Operating Temp Range-55 C ~ +155 C-55 C ~ +155 CSame
Tube Diameterphi7 standard (some phi3.5)phi7 (BSP) / phi3.5 (BOP)Same diameter system
InductanceNon-inductiveNon-inductiveEquivalent
Surge CapabilityModel-dependentNon-inductive spiral cut design, equivalent surgeEquivalent

2. Material & Process Technology Deep Comparison

The performance of high-voltage thick film resistors is fundamentally determined by the material system and manufacturing process. Below, we analyze the technical commonalities between both brands across seven key dimensions:

Technical DimensionEBG/Miba ApproachHVC ApproachAnalysis
Resistor Paste SystemMetal oxide thick film (RuO2 ruthenium-based)Ruthenium-based RuO2 thick film pasteIdentical material system, ensuring fundamental electrical characteristic commonality
Substrate Material96% Al2O3 high thermal conductivity ceramic substrate96% Al2O3 high thermal conductivity ceramic substrateSame, ensuring thermal and mechanical equivalence
Firing Temperature WindowApprox. 850 CApprox. 850 CSame process window, consistent paste-substrate interface reaction
Inductance ControlNon-inductive serpentine cutNon-inductive serpentine cutEquivalent, extremely low parasitic inductance at high frequencies
Coating SystemEpoxy / Silicone / Multi-layer composite optionalEpoxy / High-temp silicone coatingHVC covers mainstream needs; custom for special environments
Package FormOne of the originators of SOT-227 thick filmTraditional planar chip / standard tubular packageFully aligned form factor, PCB compatible
Technology LineageKirchbach HQ + Metallux collaborationLed by Chinese thick film materials engineering team, including former EBG employeesTechnology origins directly traceable to EBG school

3. Key Performance Validation: Beyond Datasheet Specifications

3.1 Partial Discharge (PD) Characteristics

For medical X-ray and high-voltage power supply applications, PD performance is the primary consideration when evaluating replacement options. Partial discharge not only accelerates insulation aging but may also introduce noise into high-sensitivity measurement circuits.

The sintering interface control between HVC's RuO₂ paste and 96% Al₂O₃ substrate is equivalent to EBG at the microscopic level. Under typical 50% rated operating voltage, the HVC BSP series achieves PD levels below <5 pC, meeting industry standards. For ultra-high sensitivity applications with special requirements, actual sample test reports are recommended for verification.

3.2 Temperature Cycle Reliability

Under standard temperature cycle test conditions from -55 C to +155 C (per MIL-STD-202 or IEC 60068), the HVC HVR series exhibits resistance drift as follows:

  • Room Temp to High Temp Cycle (25C ~ 155C): Typical drift < 0.3%, comparable to EBG equivalent products
  • Full Range Cycle (-55C ~ 155C): Typical drift < 0.5%, meeting most industrial and medical applications
  • Non-inductive Design Advantage: By avoiding stress concentration points found in wire-wound structures, thick film resistors demonstrate superior drift consistency during temperature cycling compared to equivalent wire-wound high-voltage resistors

3.3 Long-term Load Aging Stability

In 1000-hour continuous load life tests at rated power, the HVC HVR series shows a typical resistance change rate of < 1%. This data is based on the inherent stability of the RuO₂ thick film material system — the RuO₂ grain structure exhibits very gentle oxidation and phase transition trends under prolonged high-temperature operation. This is on the same order of magnitude as EBG's published long-term aging data.

4. Complete Replacement Cross-Reference Table

EBG Model Source: The EBG/Miba model numbers and form factors listed below can be found in the Miba Resistors Website 2025 Series PDF (e.g. 11_Miba_Resistors_Series_FBX_FEP_FSX_2025.pdf, 01_Miba_Resistors_Series_SGT_2025.pdf) in text layer. HVC inquiry framework. Match EBG row.

4.1 Planar Series (suffix matches Miba 2025 PDF body)

2.1 FBX/FEP/FSX (Planar)

* Planar: Max V per PDF (+25C). Size=AxB mm.

FBX

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
FBX 1/20.50 W3 kV12.90×3.40HVRGFP 1/2
FBX 5/50.65 W4.5 kV17.15×3.40HVRGFP 5/5
FBX 6/51.20 W5 kV20.00×5.08HVRGFP 6/5
FBX 8/51.60 W6 kV25.60×5.30HVRGFP 8/5
FBX 33.00 W9 kV38.30×6.60HVRGFP 3
FBX 44.00 W11.5 kV51.00×6.60HVRGFP 4
FBX 2/25.00 W16.5 kV51.00×12.90HVRGFP 2/2

FEP

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
FEP 1/20.50 W3 kV12.90×3.40HVRGFP 1/2
FEP 5/50.65 W4.5 kV17.15×3.40HVRGFP 5/5
FEP 6/51.20 W5 kV20.00×5.08HVRGFP 6/5
FEP 8/51.60 W6 kV25.60×5.30HVRGFP 8/5
FEP 33.00 W9 kV38.30×6.60HVRGFP 3
FEP 44.00 W11.5 kV51.00×6.60HVRGFP 4
FEP 2/25.00 W16.5 kV51.00×12.90HVRGFP 2/2

FSX

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
FSX 1/20.50 W4 kV13.60×4.50HVRGFP 1/2
FSX 5/50.65 W6 kV17.85×4.50HVRGFP 5/5
FSX 6/51.20 W6.5 kV20.5×6.00HVRGFP 6/5
FSX 8/51.60 W8 kV25.90×6.30HVRGFP 8/5
FSX 33.00 W12 kV38.70×7.50HVRGFP 3
FSX 44.00 W15 kV51.30×7.50HVRGFP 4
FSX 2/25.00 W22 kV51.30×14.20HVRGFP 2/2

2.2 FPX/FLX (Planar)

* Planar: Max V per PDF (+25C). Size=AxB mm.

FPX

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
FPX 1/21.50 W3 kV12.90×3.40HVRGXP 1/2
FPX 8/52.50 W6 kV25.60×5.30HVRGXP 8/5
FPX 34.00 W9 kV38.30×6.60HVRGXP 3
FPX 45.00 W11.5 kV51.00×6.60HVRGXP 4
FPX 2/27.50 W16.5 kV51.00×12.90HVRGXP 2/2

FLX

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
FLX 1/21.50 W3 kV12.90×3.40HVRGXP 1/2
FLX 8/52.50 W5 kV25.60×5.30HVRGXP 8/5
FLX 34.00 W8 kV38.30×6.60HVRGXP 3
FLX 45.00 W11.5 kV51.00×6.60HVRGXP 4
FLX 2/27.50 W16.5 kV51.00×12.90HVRGXP 2/2

2.3 MTX 967 (Config)

* Planar: Max V per PDF (+25C). Size=AxB mm.

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
MTX 967.3.251 W8 kV25.4×3.8w/ P/N to HVR custom
MTX 967.3.381.5 W10 kV38×3.8w/ P/N to HVR custom
MTX 967.5.131 W5 kV12.7×5.0w/ P/N to HVR custom
MTX 967.5.512 W20 kV50.8×5.0w/ P/N to HVR custom
MTX 967.10.252 W10 kV25.4×10.0w/ P/N to HVR custom
MTX 967.10.513 W30 kV50.8×10.0w/ P/N to HVR custom
MTX 967.15.383 W15 kV38×15.0w/ P/N to HVR custom
MTX 967.15.514.5 W30 kV50.8×15.0w/ P/N to HVR custom
MTX 967.15.765.5 W35 kV76.2×15.0w/ P/N to HVR custom
MTX 967.25.9910 W35 kV101.6×24.0w/ P/N to HVR custom

4.2 Cylindrical Series (suffix matches Miba 2025 PDF body)

3.1 SGT (+-25ppm)

* Cylindrical: Power ratings per PDF test conditions; withstand voltage uses PDF standard "Max. kV / Max. continuous operating voltage" (not "S" enhanced rating unless specified). Dimensions are φ × body length (mm, B × A metric).

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
SGT-261.0 W4 kVφ8.2×26.9HVR-BSP-7×26
SGT-321.25 W5 kVφ8.2×33.0HVR-BSP-7×32
SGT-391.5 W6 kVφ8.2×39.5HVR-BSP-7×39
SGT-522.0 W10 kVφ8.2×52.1HVR-BSP-7×52
SGT-783.0 W15 kVφ8.2×77.7HVR-BSP-7×78
SGT-1034.0 W20 kVφ8.2×102.9HVR-BSP-7×103
SGT-1245.0 W25 kVφ8.2×123.7HVR-BSP-7×124
SGT-1546.0 W30 kVφ8.2×153.7HVR-BSP-7×154

3.2 SGP / OGP Series

* Cylindrical: Power ratings per PDF test conditions; withstand voltage uses PDF standard "Max. kV / Max. continuous operating voltage" (not "S" enhanced rating unless specified). Dimensions are φ × body length (mm, B × A metric).

SGP (phi8.2)

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
SGP-202.5 W3 kVφ8.2×20.2HVR-BSP-7×20
SGP-263.7 W4 kVφ8.2×26.9HVR-BSP-7×26
SGP-324.5 W5 kVφ8.2×33.0HVR-BSP-7×32
SGP-395.2 W8 kVφ8.2×39.5HVR-BSP-7×39
SGP-527.5 W10 kVφ8.2×52.1HVR-BSP-7×52
SGP-7811 W15 kVφ8.2×77.7HVR-BSP-7×78
SGP-10312 W20 kVφ8.2×102.9HVR-BSP-7×103
SGP-12415 W25 kVφ8.2×123.7HVR-BSP-7×124
SGP-14830 W45 kVφ16×148HVR-BSP-7×148
SGP-15420 W30 kVφ8.2×153.7HVR-BSP-7×154

OGP (phi3.5)

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
OGP-131.0 W1.5 kVφ4.2×13.3HVR-BOP-3.5×13
OGP-201.5 W2 kVφ4.2×19.7HVR-BOP-3.5×20
OGP-261.9 W4 kVφ4.2×26.2HVR-BOP-3.5×26
OGP-302.5 W5 kVφ4.2×32.3HVR-BOP-3.5×30
OGP-393.0 W6 kVφ4.2×39.4HVR-BOP-3.5×39
OGP-523.3 W10 kVφ4.2×49.5HVR-BOP-3.5×52

3.3 SSP/OSP

* Cylindrical: Power ratings per PDF test conditions; withstand voltage uses PDF standard "Max. kV / Max. continuous operating voltage" (not "S" enhanced rating unless specified). Dimensions are φ × body length (mm, B × A metric).

SSP

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
SSP-204.0 W0.8 kVφ8.2×20.2HVR-BSP-7×20
SSP-266.0 W2 kVφ8.2×26.9HVR-BSP-7×26
SSP-328.0 W4.5 kVφ8.2×33.0HVR-BSP-7×32
SSP-3910.0 W4.5 kVφ8.2×39.5HVR-BSP-7×39
SSP-5212.5 W6 kVφ8.2×52.1HVR-BSP-7×52
SSP-14840.0 W6 kVφ16×148HVR-BSP-7×148

OSP

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
OSP-102.0 W1 kVφ4.2×10.9HVR-BSP-7×10
OSP-132.4 W1 kVφ4.2×13.7HVR-BSP-7×13
OSP-203.0 W1 kVφ4.2×19.7HVR-BSP-7×20

3.4 OSX/SSX/SOX

* Cylindrical: Power ratings per PDF test conditions; withstand voltage uses PDF standard "Max. kV / Max. continuous operating voltage" (not "S" enhanced rating unless specified). Dimensions are φ × body length (mm, B × A metric).

OSX (phi4)

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
OSX-100.80 W1.5 kVφ4.0×10.8HVR-BSP-7×10
OSX-131.0 W1.5 kVφ4.0×13.4HVR-BSP-7×13
OSX-201.50 W3 kVφ4.0×19.7HVR-BSP-7×20
OSX-261.95 W4 kVφ4.0×26.0HVR-BSP-7×26
OSX-302.30 W6 kVφ4.0×32.4HVR-BSP-7×30
OSX-393.10 W6 kVφ4.0×39.4HVR-BSP-7×39

SSX (phi8.2)

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
SSX-202.30 W5 kVφ8.2×20.2HVR-BSP-7×20
SSX-263.90 W7.5 kVφ8.2×27.2HVR-BSP-7×26
SSX-324.20 W8.5 kVφ8.2×33.0HVR-BSP-7×32
SSX-394.60 W11 kVφ8.2×39.5HVR-BSP-7×39
SSX-527.80 W16 kVφ8.2×52.0HVR-BSP-7×52
SSX-7811.70 W24 kVφ8.2×77.6HVR-BSP-7×78
SSX-10312.50 W32 kVφ8.2×103.2HVR-BSP-7×103
SSX-12415.50 W40 kVφ8.2×123.7HVR-BSP-7×124
SSX-15419.40 W48 kVφ8.2×153.7HVR-BSP-7×154

SOX (phi8.6)

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
SOX-201.20 W5 kVφ8.6×21.3HVR-BSP-7×20
SOX-261.60 W7.5 kVφ8.6×27.5HVR-BSP-7×26
SOX-392.50 W11 kVφ8.6×40.2HVR-BSP-7×39
SOX-523.40 W16 kVφ8.6×52.5HVR-BSP-7×52
SOX-785.00 W24 kVφ8.6×78.7HVR-BSP-7×78
SOX-1036.50 W32 kVφ8.6×104.1HVR-BSP-7×103
SOX-1248.20 W40 kVφ8.6×124.2HVR-BSP-7×124
SOX-15410.60 W48 kVφ8.6×154.5HVR-BSP-7×154

3.5 PHV (Encaps)

* Cylindrical: Power ratings per PDF test conditions; withstand voltage uses PDF standard "Max. kV / Max. continuous operating voltage" (not "S" enhanced rating unless specified). Dimensions are φ × body length (mm, B × A metric).

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
PHV-395.2 W12.8 kVφ8.2×39.5HVR-BSP-7×39 + + encapsulation
PHV-527.2 W16 kVφ8.2×52.1HVR-BSP-7×52 + + encapsulation
PHV-7811 W24 kVφ8.2×77.7HVR-BSP-7×78 + + encapsulation
PHV-10312 W32 kVφ8.2×102.9HVR-BSP-7×103 + + encapsulation
PHV-20025 W60 kVφ8.2×192.0HVR-BSP-7×200 + + encapsulation

3.6 MTX 968 / 969 / 969 W / MTX 2000

* Cylindrical: Power ratings per PDF test conditions; withstand voltage uses PDF standard "Max. kV / Max. continuous operating voltage" (not "S" enhanced rating unless specified). Dimensions are φ × body length (mm, B × A metric).

MTX 968

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
MTX 968.23.8 W9 kVφ8×27HVR-BSP Divider sample (MTX 968.2); see PDF
MTX 968.35 W12 kVφ8×37HVR-BSP Divider sample (MTX 968.3); see PDF
MTX 968.57.5 W18 kVφ8×52HVR-BSP Divider sample (MTX 968.5); see PDF
MTX 968.710 W24 kVφ8×78HVR-BSP Divider sample (MTX 968.7); see PDF
MTX 968.1012.5 W36 kVφ8×103HVR-BSP Divider sample (MTX 968.10); see PDF
MTX 968.1215 W42 kVφ8×128HVR-BSP Divider sample (MTX 968.12); see PDF
MTX 968.1517 W54 kVφ8×153HVR-BSP Divider sample (MTX 968.15); see PDF

MTX 969

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
MTX 969.1111 W24 kVφ13.5×81HVR-BSP + end cap sample (MTX 969.11); HVR-BSP + cap
MTX 969.2323 W48 kVφ13.5×156HVR-BSP + end cap sample (MTX 969.23); HVR-BSP + cap
MTX 969.5454 W48 kVφ30.5×160HVR-BSP + end cap sample (MTX 969.54); HVR-BSP + cap
MTX 969.7171 W64 kVφ30.5×210HVR-BSP + end cap sample (MTX 969.71); HVR-BSP + cap
MTX 969.105105 W96 kVφ30.5×308HVR-BSP + end cap sample (MTX 969.105); HVR-BSP + cap

MTX969W (Water)

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
MTX 969 W-S500 W max.5 kVL≈117 (Water-cooled)With cooling/power curve → water-cooled engineering solution
MTX 969 W1000 W max.7 kVL≈195 (Water-cooled)With cooling/power curve → water-cooled engineering solution
MTX 969 W-L1700 W max.10 kVL≈337 (Water-cooled)With cooling/power curve → water-cooled engineering solution

MTX2000 (Divider)

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
MTX 2000.2310 W40 kVφ13.5×156HVR-BSP + Divider ratio (MTX 2000.23); divider custom
MTX 2000.10550 W80 kVφ30.5×308HVR-BSP + Divider ratio (MTX 2000.105); divider custom

3.7 ESP (Pulse)

ESP pulse type; incl P/N.

EBG / Miba P/N Power Max Cont. V DC* Size (mm) HVC Replacement
ESP-62/14High pulse1kV DC62×15 (body×Ø, see PDF)HVR-BSP Pulse inquiry
ESP-62/20High pulse1kV DC62×21 (body×Ø, see PDF)HVR-BSP Pulse inquiry

5. Global Market Positioning Comparison

DimensionEBG / MibaHVC
Brand HistoryFounded in 1977, nearly 50 years of industry heritageThick film business launched in 2017, rapid catch-up
Corporate BackgroundMiba AG publicly traded (Austria, Frankfurt Stock Exchange)HVC independent brand (Shenzhen), focused on HV passive components
Market PositionEuropean leading HV thick film specialist, premium positioningEquivalent quality + agile supply chain at competitive value
Technology OriginKirchbach in-house R&D + Metallux production collaborationLed by former EBG engineering team + Sino-German joint venture tech background
Verified ClientsGlobal top OEMs in medical/industrial/energy sectorsSpellman / Hitek Power / Planmeca / iRay etc. verified in volume production
Standard Lead Time16~24 weeks3~4 weeks
Service ModelDistributor networkFactory direct + Chinese technical support team
Pricing StrategyEuropean manufacturing cost + brand premiumAsian manufacturing cost advantage, typically 20%~40% lower

6. Verified Customer Case Studies Summary

CustomerCountry/RegionApplicationEBG Series ReplacedVerification Status
Planmeca Oy (Finland, top 3 global dental CBCT)Northern Europe, FinlandDental CBCT HV divider networkSGT, SGP, FBXVolume production, on AVL
Haining Jingyi Electronics (affiliated with iRay, SH688301)China ZhejiangX-ray HV coreSGP, SSP, FPXVolume production 18+ months
Multiple Israeli X-ray OEMsIsraelPortable X-ray/NDTSGT, FBXProject volume supply
Spellman / Hitek PowerUSA / UKHV power module divider and loadMTX 968, SGT, PHVVerified and began supply

7. Contact & Technical Support

If you require complete HVR series test reports, comparison sample kits, or more in-depth parameter benchmarking analysis, please contact the HVC technical team. We offer free samples and manufacturer-level testing support for qualified validation projects.

Copyright Notice: This document is copyrighted by HVC Capacitor. Unauthorized reproduction or commercial use is prohibited.
Disclaimer: The comparison data in this document is based on HVC laboratory measurements and is for reference only. Final performance is subject to actual sample test reports and mutually confirmed technical agreements. EBG / Miba are registered trademarks of Miba AG. This document is for technical compatibility reference only.

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