Do I need to redesign my PCB when switching to HVC capacitors?
In most cases, HVC's drop-in replacement capacitors require zero PCB redesign — our products are engineered to match the mechanical footprint, terminal configuration, and mounting hardware of major legacy brands (Vishay 715C, TDK UHV/FHV, Murata DHS, AVX HP/HW series). However, certain edge cases may require minor adjustments.
| Replacement Scenario | PCB Change Required? | Typical Action Needed | |
|---|---|---|---|
| Direct pin-compatible equivalent (same footprint) | ❌ No change | Drop-in replacement, reflow/solder as-is | |
| Slightly different body diameter (±3mm) | ⚠️ Maybe | Verify clearance to adjacent components | |
| Different terminal type (thread vs solder lug) | ⚠️ Maybe | Add threaded insert or change mounting hole | |
| Higher voltage class (larger creepage needed) | ⚠️ Likely | Increase pad spacing or add isolation slot | |
| Significantly different form factor | ✅ Yes | Layout revision required (rare for catalog parts) | |
| Legacy Part | HVC Equivalent | Footprint Match | Notes |
| Vishay 715C20Pxxxxx (Ø38mm) | HVCT8G-20K-xxxx | Pin-compatible | Same Ø38mm, same M6 thread |
| TDK UHV-6A (Ø45mm) | HVCT8G-60K-xxxx | Pin-compatible | Same Ø45mm, same M8 thread |
| Murata DHS series (Ø25mm) | HVCT8G-15K-xxxxS | Pin-compatible | Same Ø25mm, M5 thread |
| AVX HP80 series (Ø50mm) | HVCT8G-80K-xxxxD | Pin-compatible | Same Ø50mm, M10 thread |
| SAMWHA HVD series (various) | HVCT8G matching | Pin-compatible | Direct dimensional match |
| Voltage Class | Min Creepage (Pollution Degree 2) | Min Clearance | |
| Up to 20kV | 25mm | 16mm | |
| 20kV – 40kV | 40mm | 28mm | |
| 40kV – 80kV | 63mm | 45mm | |
| Above 80kV | Per calculation | Per calculation | |
| Thread Size | Recommended Torque | Tool | |
| M5 | 1.5 – 2.0 Nm | Hex socket driver | |
| M6 | 2.5 – 3.5 Nm | Hex socket driver | |
| M8 | 4.0 – 6.0 Nm | Torque wrench recommended | |
| M10 | 8.0 – 12.0 Nm | Torque wrench required |
Adjustment #3: Thermal Relief Pad
For high-current applications, ensure adequate copper area around terminals:
* Minimum: 10mm × 10mm solid copper per terminal
* Recommended: Connected to internal ground plane for heat spreading
* Best practice: Additional thermal vias under mounting pads for multi-layer boards
Contact: Sales Department
Phone: +86 13689553728
Tel: +86-755-61167757
Email: sales@hv-caps.com
Add: 9B2, TianXiang Building, Tianan Cyber Park , Futian, Shenzhen, P. R. C